upg2024tq nec's gaas mmic dpdt switch for 5 ghz band california eastern laboratories ? operating frequency: 4.8 to 5.85 ghz ? low insertion loss: 1.2 db typ. @ 4.8 to 5.85 ghz ? power handling: p in (0.1 db) = +32 dbm typ. @ 4.8 to 5.85 ghz ? control voltage: +2.8 v/0 v typ. ? high isolation: (between tx and rx) = 30 db typ. @ 5.2 ghz (between ant1/2 and rx/tx) = 25 db typ. @ 5.2 ghz ? input/output return loss: 20 db typ. @ 4.8 to 5.85 ghz ? switching speed: 20 ns typ. @ t rise /t f all (10/90% rf) ? high-density surface mounting: 10-pin plastic tson package (2.30 2.55 0.60 mm) ? pb-free features data sheet ordering information remark to order evaluation samples, contact your nearby sales of ce. part number for sample order: upg2024tq-a nec's upg2024tq is a high power gaas mmic dpdt switch for 5 ghz band wireless lan and other applications. the upg2024tq combines high performance features in a pb-free low pro le (0.6 mm max height) 2.30 mm x 2 .55 mm package. description ? 5 ghz band wireless lan (802.11a) ? 5 ghz electronic toll collection ? 5 ghz fixed wireless access applications p art number package marking supplying form pg2024tq-e1-a 10-pin plastic tson 2024 ? embossed tape 8 mm wide ? pin 5, 6 face the perforation side of the tape ? qty 3 kpcs/reel
upg2024tq pin connections and internal block diagram absolute maximum ratings (t a =+25oc, unless otherwise speci ed) recommended operating range (t a =+25oc) 2024 10 9 8 7 6 12345 (top view) 678910 54321 (bottom view) gnd pin no. pin name 1tx 2v cont1 3v cont2 4 gnd 5rx 6ant1 7v cont3 8v cont4 9 gnd 10 ant2 p arameter symbol ratings unit control voltage v cont ? 6.0 to +6.0 note 1 v input power p in +36 dbm t otal power dissipation p tot 0.15 note 2 w operating ambient temperature t a ? 45 to +85 c storage temperature t stg ? 65 to +150 c notes 1. within the condition of | v cont1 ? v cont2 | 6.0 v 2. mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass pwb, t a = +85 c p arameter symbol min. typ. max. unit control voltage (high) v cont (h) 2.7 2.8 3.3 v control voltage (low) v cont (l) ? 0.2 0 +0.2 v operating frequency f 4.8 5.5 5.85 ghz operating ambient temperature t a ? 40 +25 +85 c
upg2024tq electrical characteristics ( t a = +25 c, v cont = 2.8 v/0 v, z o = 50 , dc block capacitor = 2 pf, each port) standard characteristics for reference (t a = +25 c, v cont = 2.8 v/0 v, z o = 50 , dc block capacitors = 2 pf, each port) pa rameter symbol test conditions min. typ. max. unit insertion loss l ins f = 4.9 ghz ? 1.2 1.5 db f = 5.2 ghz ? 1.2 1.5 f = 5.8 ghz ? 1.5 1.7 isolation (between tx and rx) isl f = 4.9 ghz 20 25 ? db f = 5.2 ghz 25 30 ? f = 5.8 ghz 20 25 ? input return loss rl in f = 4.9 ghz 10 20 ? db f = 5.2 ghz 10 20 ? f = 5.8 ghz 7 20 ? output return loss rl out f = 4.9 ghz 10 20 ? db f = 5.2 ghz 10 20 ? f = 5.8 ghz 7 20 ? 0.1 db gain compression input power p in (0.1 db) f = 4.9 ghz 30 33 ? dbm f = 5.2 ghz 30 32 ? f = 5.8 ghz 30 32 ? switching speed t sw t rise /t f all (10/90% rf) ? 20 ? ns control current i cont ? 5 ? a input 3rd order intercept point iip 3 ? 50 ? dbm p arameter symbol test conditions min. typ. max. unit isolation (between ant1/2 and rx/tx) isl f = 4.9 ghz ? 22 ? db f = 5.2 ghz ? 25 ? f = 5.8 ghz ? 21 ? truth table v cont1 v cont2 v cont3 v cont4 p ass low high high low ant1-rx high low low high ant2-tx high low high low ant1-tx low high low high ant2-rx
upg2024tq evaluation circuit the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 12345 10 9 8 7 6 v cont1 tx rx gnd c bypass c bypass c rf c rf v cont2 v cont4 ant2 ant1 gnd c bypass c bypass c rf c rf v cont3 remark c rf : 2 pf c bypass : 1 000 pf
upg2024tq p ackage dimensions 10-pin plastic tson (unit:mm) (bottom view) (0.15) (1.70) (0.30) (0.95) (0.05) (1.95) (0.30) 0.400.05 2.250.1 2.550.15 0.180.05 2.200.1 2.300.15 (0.125) (0.60 max.) remark ( ) : reference value
upg2024tq recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales of ce. soldering method soldering conditions condition symbol infrared re ow peak temperature (package surface temperature) : 260 c or below t ime at peak temperature : 10 seconds or less t ime at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of re ow processes : 3 times maximum chlorine content of rosin ux (% mass) : 0.2%(wt.) or below ir260 vps peak temperature (package surface temperature) : 215 c or below t ime at temperature of 200 c or higher : 25 to 40 seconds preheating time at 120 to 150 c : 30 to 60 seconds maximum number of re ow processes : 3 times maximum chlorine content of rosin ux (% mass) : 0.2%(wt.) or below vp215 w ave soldering peak temperature (molten solder temperature) : 260 c or below t ime at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of ow processes : 1 time maximum chlorine content of rosin ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (pin temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together (except for partial heating). life support applications these nec products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod ucts can reasonably be expected to result in personal injury. the customers of cel using or selling these products for use in such applications do so at their own risk and agree to fully indemnify cel for all damages resulting from such improper use or sale. a business partner of nec compound semiconductor devices, ltd. 06/08/2004
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